24X view of an IC

The same IC at 65X

At 250X, ball bonds may be inspected

Also at 250X, wedge bonds are revealed

Image of a surface mounted IC permits inspection of the wires within the IC and the solder joint quality of the leads, revealing insufficient solder on the right-most lead.

Image of a micro BGA, rotated, reveals wire sweeps and solder ball shape.

Solder joints on a flip chip: note the large number of voids in each joint and bridging at the left side.

Dimensional view of solder balls pinpoints the precise location of solder voids within the balls.

Die attach, showing voids in the epoxy connecting the silicon to the metal lead frame.