The RTX Series
For X-ray inspection of PCB Boards and More
Glenbrook’s RTX Series of modular, real-time systems include models designed to meet a variety of production requirements including circuit board components. Numerous options make it easy to customize any RTX model to your specific application. All hardware and software elements are fully compatible to ensure the continued value of your equipment.
RTX-113™
First Tier Machine for Inspecting Multilayer and Assembled Printed Circuit Boards
Description
Glenbrook’s RTX-113 is designed for heavy production environments where X-ray is used to inspect PCBs and assembled PCBs containing advanced components such as BGA, micro BGA, QFN and other devices.
The system is very versatile and features Glenbrook’s patented, award-winning X-ray camera technology that generates high-resolution, high-sensitivity images, revealing defects as small as 0.001 inch with a full one inch diameter field of view. The RTX-113 provides affordable real-time X-ray imaging, reliable operation and easy servicing.
Specifications
Dimensions: 44”H x 42”W x 24”D (1066.8mm x 1117.6mm x 609.8mm)
Operating Voltage: 120v, 60hz or 220v, 50hz
Contrast Resolution: Can resolve .001 gold wire
Spatial Resolution: 20 lp/mm (with MicroTech™ option, up to 100 lp/mm)
Anode Voltage: 52 kv or optional 80 kv
Anode Current: 50 or 90 microamps
Magnification: 15x geometric to 50x optical
Focal Spot to Image Plane Distance: 4-6 inches
X-ray Activation Mode: Foot Pedal or PC Controlled
RTX-113HV
Designed for inspection of multi-layer and assembled printed circuit boards with dense metal BGAs
Description
Our RTX-113HV system meets all your needs for inspecting BGA packages, including those that contain dense metal heat sinks that require a higher voltage X-ray source to clearly identify and troubleshoot production faults. The cabinet design permits easy integration into even the busiest production environments, and is totally upgradeable. Recommended for lead free inspection requirements
Specifications
- Operating Voltage: 120v/220v, 50-60hz
- Contrast Resolution: Can resolve .001 gold wire
- Spatial Resolution: 20 lp/mm (with MicroTech option,
up to 100 lp/mm) Anode Voltage: 80 kV - Anode Current: 150 microamps
- Machine Dimensions: 50”H x 60”W x 33”D (1270mm x 1524mm x 839mm)
- Focal Spot to Image Plane Distance: 4-6 inches
- XRTV Zoom Camera (4X-50X magnification)
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RTX-113HV MicroTech (3500 Series)
Ideal for inspection of small hole drilling in PCBs, BGA and micro BGA components, QFNs, LEDs, and medical devices—making it a powerful tool for electronics manufacturing and medical device quality assurance.
Description
The RTX-113HV MicroTech (3500 Series) X-ray Inspection System delivers high performance imaging in a compact design that fits seamlessly into both laboratory and production environments.
Specifications
Magnification: up to 100x geometric + 225x optical
Motorized X-Y Positioner Travel: 19″ x 15″
Voltage: Auto switching 120v or 220v
Contrast Resolution: Can resolve .001 gold wire
Spatial Resolution: 20lp/mm up to 100lp/mm
Anode Voltage: 40Kv-80Kv (PC Controlled)
Anode Current: 20-150 microamps
X-ray Tube Focal Spot: 30 micron (optional 10
micron)
Machine Dimensions: 43” X 36” X 52”
Cabinet Interior Dimensions: 42” X 30”
RTX Backplane
Designed for Large and Heavy Backplane Panels for Multilayer and Assembled PC Boards
The RTX Backplane x-ray inspection system can accommodate boards up to 36″ X 42″ weighing up to 40 pounds. It can also inspect up to 32-layer, 0.4 inch thick PCBs and easily detects inner layer errors and checks for hole-pad alignment during drilling. The RTX Backplane can also inspect solder bond integrity of BGAs, LEDs, die attach and Flip Chip locations, and drilled holes on both small and standard boards.
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