This video showcases advanced X-ray imaging technologies developed by Glenbrook Technologies, as described in U.S. Patent Nos. 6,009,145 and 7,426,258. Captured in real-time, the footage reveals the dynamic reflow process of a Ball Grid Array (BGA) during soldering.

As the solder is heated, it melts and wicks from each solder bump to its corresponding pad, creating a pulling force that causes the BGA to self-align with precision. This self-centering action ensures optimal connectivity and uniform, round solder joints—critical for high-reliability electronics assembly.

Glenbrook’s patented X-ray inspection systems provide unmatched visibility into this essential stage of BGA placement, enabling precise monitoring and quality control during reflow soldering.