JewelBox X-Ray Images
High-Resolution Inspection for Electronics Fabrication Applications
Progressive magnification allows inspection of multiple details:
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| 24X view of an IC | The same IC at 65X |
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| At 250X, ball bonds may be inspected | Also at 250X, wedge bonds are revealed |
| Image of a surface mounted IC permits inspection of the wires within the IC and the solder joint quality of the leads, revealing insufficient solder on the right-most lead. |  |
| Image of a micro BGA, rotated, reveals wire sweeps and solder ball shape. |  |
| Solder joints on a flip chip: note the large number of voids in each joint and bridging at the left side. |  |
| Dimensional view of solder balls pinpoints the precise location of solder voids within the balls. |  |
| Die attach, showing voids in the epoxy connecting the silicon to the metal lead frame. |  |
