BGA Inspection Archive
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The World’s First BGA X-ray Reflow Movie
Posted on October 26, 2011 | No CommentsThis video was captured using technologies developed by Glenbrook Technologies and described in patent numbers: 6,009,145 and 7,426,258. The video dramatically shows the BGA self-aligning during reflow. The process begins... -
Voltage Blooming: an open letter and report to the industry
Posted on March 22, 2011 | No Comments“Voltage Blooming” of Real-Time X-ray Images: Ensuring accuracy when measuring the percentage of voids in BGA solder bonds By Gilbert Zweig, President, Glenbrook Technologies, Inc. Ever since the introduction of... -
Glenbrook’s NEW Programmable Positioning Dramatically Increases Productivity in High-Volume X-Ray Inspection
Posted on March 22, 2011 | No CommentsThis new technology enables Glenbrook X-ray Inspection Systems to automatically step from component to component and board to board through simple touch-screen programming. Two scan modes are available to cover... -
Glenbrook’s NEW Dual-VU™ – View Simultaneous Real-Time X-Ray and Optical Imaging of Electronic and Medical Components
Posted on March 1, 2010 | No CommentsMarch 2010 Glenbrook Technologies introduces The Dual-VU system providing simultaneous and corresponding magnified real-time x-ray and optical imaging of electronic and medical components. This unique patented* development provides a quality... -
How Assemblers Use X-Ray Inspection for BGA
Posted on August 1, 1997 | No CommentsBy Steven A. Zweig Ball grid array package handling has it own set of problems and requirements. In replies from the field, five assemblers report how the technology is meeting... -
Exposing BGA: Increase Yields with X-ray Inspection
Posted on December 1, 1995 | No CommentsBy Gilbert Zweig The incorporation of BGA packages into electronics assembly has made inspection issues of these leadless components a primary concern. Because solder bonds hidden underneath the package preclude...
