BGA Inspection

SMT/BGA Inspection - Precision Images for Advanced Assembly

Many manufacturers of advanced SMT assemblies rely on real-time x-ray technology to evaluate solder joint integrity for BGAs and other leadless packages that cannot be inspected by conventional vision systems.

For assemblers who measure BGA solder voids to determine quality, Glenbrook's patented x-ray camera offers a unique advantage: it is the only system not subject to Voltage Blooming. Void sizes remain consistent at all voltages, providing reliable pass/fail data.

As an alternative to large packages with high pin counts, ball grid arrays (BGAs) have distinct benefits: smaller size, lower inductance, reduced coplanarity and lack of skewing. But once a BGA is placed, how can the integrity of its solder bond be measured?

Many manufacturers of advanced SMT assemblies rely on Glenbrook's real-time x-ray technology to evaluate solder joint integrity for BGAs and other leadless packages that cannot be inspected by conventional vision systems. In the course of working with our systems, these manufacturers have verified a fundamental principle of productive assembly: it's more effective to inspect the process, rather than the product.

Real-time x-ray inspection helps to establish quality as an integral part of your process, right from the start, and to maintain it throughout your line, for BGA evaluation or any other aspect of the process. In the development stage, real-time x-ray inspection defines the optimal parameters required to maintain a process in control. During production audits, it ensures that those parameters are being maintained.

To support SMT/BGA inspection, Glenbrook offers products for process development and quality assurance:

• The RTX Series of x-ray inspection systems
• The JewelBox series
• Image Processors

  Glenbrook's NEW Dual-VU™ — View Simultaneous Real-Time X-Ray and Optical Imaging of Electronic and Medical Components

  Glenbrook's Exclusive Technology
  Glenbrook's NEW Programmable Positioning Dramatically Increases Productivity in High-Volume Inspection