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Reel to reel x-ray inspection of electronic components
Articles
Understanding the Counterfeit Components Problem
By Steve Zweig About four years ago, a component distributor called me and asked about using our x-ray inspection equipment to detect counterfeit components. At the time, I thought this…
Medical Device Manufacturing: Design for X-ray Inspection
Read about Glenbrook in the August isse of MD&DI http://www.mddionline.com/article/design-devices-x-ray-inspection
The Glenbrook Advantage
What is the Glenbrook Advantage?Glenbrook Technologies has developed the MXRA® real-time x-ray imaging camera with resolution and sensitivity unmatched in the world today. The MXRA® camera performs, in effect, as…
Radiation Safety
A Resource for Radiation Safety and Regulatory Information Over the years, Glenbrook Technologies has served as a resource of radiation safety and regulatory information for our customer base. We pride…
Detecting Counterfeit Electronic Components
X-ray: on the front line of the battle against counterfeit components Going through security screening may be a necessary nuisance for airline travelers, but it’s nothing compared to what electronic…
Voltage Blooming: an open letter and report to the industry
“Voltage Blooming” of Real-Time X-ray Images: Ensuring accuracy when measuring the percentage of voids in BGA solder bonds By Gilbert Zweig, President, Glenbrook Technologies, Inc. Ever since the introduction of…
Making Headlines – Magnification Fluoroscopy
Read about Magnification Fluroscopy at MedicalDevice-Network.com
The Physical Mechanisms of Radiological Imaging (Presented at AALAS Oct. 2007)
Click here to request the report
How Assemblers Use X-Ray Inspection for BGA
By Steven A. Zweig Ball grid array package handling has it own set of problems and requirements. In replies from the field, five assemblers report how the technology is meeting…
Exposing BGA: Increase Yields with X-ray Inspection
By Gilbert Zweig The incorporation of BGA packages into electronics assembly has made inspection issues of these leadless components a primary concern. Because solder bonds hidden underneath the package preclude…